Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
Author | : Xing-Chang Wei |
Publisher | : CRC Press |
Total Pages | : 0 |
Release | : 2017 |
ISBN-10 | : 1138033561 |
ISBN-13 | : 9781138033566 |
Rating | : 4/5 (566 Downloads) |
Download or read book Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: 7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index