Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel

Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel
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Total Pages : 24
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ISBN-10 : STANFORD:36105211349712
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Book Synopsis Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel by : John M. Black

Download or read book Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel written by John M. Black and published by . This book was released on 1961 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives containing combinations of polyamide resin with melamine compounds, epoxy resins with vinyl anhydride copolymers, and inorganic fillers were studied as heat-resistant bonding agents for stainless steel. Attempts to improve the strength of the polyamide-melamine type adhesive at 550° F. were unsuccessful. Studies were made of the heat-resistant properties of eight different epoxy resins modified with an ethyl acrylate-maleic anhydride copolymer and with maleic anhydride. The most promising of these were adhesive formulations of epoxy resins which were glycidyl ethers of either bisphenol A or tetra hydroxy phenyl ethane and contained aluminum powder and arsenic pentoxide fillers impregnated into asbestos cloth. (Author).


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