Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514

Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514
Author :
Publisher :
Total Pages : 596
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ISBN-10 : UOM:39015045684308
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Book Synopsis Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 by : S. P. Murarka

Download or read book Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 written by S. P. Murarka and published by . This book was released on 1998-11-02 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR


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