Download or read book Application of Capacitor Microphones and Magnetic Pickups to the Tuning and Trouble Shooting of Microelectronic Ultrasonic Bonding Equipment written by George G. Harman and published by . This book was released on 1971 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic ultrasonic wire bonding equipment typically welds wires to integrated circuits at frequencies between 50 and 65 kHz. Mechanical vibrations at these frequencies are difficult to measure directly and malfunctions of the system may not be recognized. Two different methods of measuring these vibrations are described. The first method involves use of a capacitor microphone and a tapered tip, and the second method use of a small magnetic pickup. Procedures are given for establishing a specific ultrasonic vibration amplitude, tuning the ultrasonic system to resonance, and diagnosing both mechanical and electrical problems in wire bonding equipment. Although these techniques and procedures were developed for ultrasonic wire bonding equipment, they are applicable to other ultrasonic welding systems of lead attachment, such as flip-chip, beam lead and spider bonding.