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Modeling and Application of Flexible Electronics Packaging
Language: en
Pages: 287
Authors: YongAn Huang
Categories: Technology & Engineering
Type: BOOK - Published: 2019-04-23 - Publisher: Springer

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes accor
Advanced Materials for Printed Flexible Electronics
Language: en
Pages: 641
Authors: Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2021-10-04 - Publisher: Springer Nature

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This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, pr
Manufacturing Challenges in Electronic Packaging
Language: en
Pages: 270
Authors: Y.C. Lee
Categories: Science
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-05-17 - Publisher: John Wiley & Sons

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe