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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding h
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysi
An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition
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This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital
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There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the
Interconnection Noise in VLSI Circuits
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This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is toward