Ic Interconnect Analysis
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Type: BOOK - Published: 2007-05-08 - Publisher: Springer Science & Business Media
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the i
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Describes a variety of interconnect analysis techniques with different efficiency-accuracy tradeoffs. The authors survey very simple delay metrics that can be u
Language: en
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Language: en
Pages: 640
Pages: 640
Type: BOOK - Published: 2010-10-22 - Publisher: McGraw Hill Professional
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliabilit
Language: en
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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of
